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Referencia 10059 |
| Título: |
Nueva técnica de unión para conexiones de carga en electrónica de potencia |
| Título original: |
New joining technique for load connections for power electronics |
| Autor: |
Dipl.-Ing. Benjamin Mehlmann, Dr. Alexander Olowinsky |
| Resumen: |
The Fraunhofer Institute for Laser Technology ILT has developed a technique for high precision laser microwelding of load connections with local power modulation.
Alongside the battery, power electronics constitute the heart of future electromobility, facilitating the necessary conversion of high voltages and currents within electric voltage transformers. The power electronics are built up from modules of semiconductors and direct copper bonded (DCB) or direct aluminum bonded (DAB) substrates. These modules are connected to the external power circuits by load connections made out of copper or aluminum. The load connections tend to be joined directly to the metal layers of the substrates – which are just a few hundred micrometers thick – using ultrasonic welding. However, this can lead to conchoidal fractures and cracks in the ceramic below the metallization.
As an alternative, Fraunhofer ILT has developed a technique for joining the load connections using laser microwelding. By applying spatial power modulation techniques to the process of microwelding, the current-carrying weld cross-section between the load connection and metallization can be tailored to varying requirements without damaging the ceramic layer. The load connections can be joined quickly and reliably using an overlap joint or a fillet seam with thicker sheet metals measuring up to 0.8 mm. H16 in Hall 6, the joint stand hosted by IVAM, will feature exhibits such as DAB substrates with laser-welded load connections. |
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| Idioma: |
Inglés |
País: |
Germany |
Año: |
2011 |
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| Tipo: |
Artículo |
| Área: |
Procesos > Soldadura y tecnologías de unión
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| Subsectores de aplicación: |
· Maquinaria y bienes de equipo
· Automoción e industria auxiliar
· Fabricación de productos metálicos, excepto maquinaria y equipo
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| Entidad: |
Fraunhofer Institute for Laser Technology ILT |
| Fuente: |
Fraunhofer Institute for Laser Technology ILT |
| Localización en fuente: |
Press release, February 15 |
| Descriptores: |
joining technique (técnicas de unión), load connections (conexiones de carga), power electronics (electrónica de potencia) |
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